Portland-State-University 2019-2020 Bulletin

ECE 514 Microsystem Integration and Packaging

Introduction to integrated circuit packaging and microelectronics system integration; signal integrity; electrical, mechanical, and thermal aspects of microsystem package simulation and design; electronics packaging materials; microsystem reliability and failure mechanisms; current technology developments.

Credits

4

Prerequisite

senior or graduate standing in ECE.
  • Up one level
  • 500