ECE 516 Integrated Circuit (IC) Technologies

Microelectronic processing of solid-state devices and integrated circuits. A base for understanding more advanced processing and what can and cannot be achieved through IC fabrication. Oxidation, diffusion, and ion implantation will be discussed. Bipolar, CMOS and BiCMOS fabrication processes. DRAM technology. Defining system rules for IC layout. Packaging and yield. New technologies, such as Wafer-Scale Integration and Multi-Chip Modules, will be discussed. Students will be introduced to the concept of designing for manufacturability. Also offered for undergraduate-level credit as ECE 416 and may be taken only once for credit.