ME 578 Introduction to Electronic Packaging

This course provides a foundation on mechanical and materials aspects of electronic packaging as well as an understanding of the fundamental mechanical principles used in the design of electronic packages, boards, sub-systems, and systems with focus on their integration. Topics include design, properties, materials, interconnections, assembly processes, performance of various packaging systems, thermal management, failure mechanisms and reliability. Also offered for undergraduate-level credit as ME 478 and may be taken only once for credit.