Portland-State-University 2014-2015 Bulletin

ECE 414 Microsystem Integration and Packaging

Introduction to integrated circuit packaging and microelectronics system integration; signal integrity; electrical, mechanical, and thermal aspects of microsystem package simulation and design; electronics packaging materials; microsystem reliability and failure mechanisms; current technology developments. Also offered for graduate-level credit as ECE 514 and may be taken only once for credit.




Prerequisites: senior or graduate standing in ECE.
  • Up one level
  • 400