Portland-State-University 2016-2017 Bulletin

ME 578 Introduction to Electronic Packaging

This course provides a foundation on mechanical and materials aspects of electronic packaging as well as an understanding of the fundamental mechanical principles used in the design of electronic packages, boards, sub-systems, and systems with focus on their integration. Topics include design, properties, materials, interconnections, assembly processes, performance of various packaging systems, thermal management, failure mechanisms and reliability.

Credits

4
  • Up one level
  • 500